• DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing
  • DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing
  • DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing
DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing

DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing

Détails sur le produit:

Lieu d'origine: Chine
Nom de marque: Dupont
Certification: ISO9001
Numéro de modèle: DUPONT ™ Ambertec ™ UP6150 H / OH
Documents: IER-AmberTec-UP6150-H-OH-PD...en.pdf

Conditions de paiement et expédition:

Quantité de commande min: 1 pièce
Prix: négociable
Détails d'emballage: Emballage standard d'exportation
Délai de livraison: 5- 8 jours de travail
Conditions de paiement: T/T
Capacité d'approvisionnement: 60000 unités par mois
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Détail Infomation

Plage de température: 15 - 25 ° C (59 - 77 ° F) Plage de pH: 0-14
Poids d'expédition: 730 g / L Résistivité (UPW): ≥ 18 MΩ · cm
Résistivité (sel): ≥ 18 MΩ · cm Capacité d'échange: ≥ 1,80 éq/L
Mettre en évidence:

DuPont AmberTec UP6150 ion exchange resin

,

mixed bed resin ultrapure water polishing

,

18 MΩ·cm water treatment resin

Description de produit

DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing
Product Overview

DuPont™ AmberTec™ UP6150 H/OH is a fully regenerated, separable, uniform particle size mixed bed ion exchange resin specifically designed for final polishing in ultrapure water (UPW) systems. In properly designed systems, it delivers 18 MΩ·cm resistivity water with total organic carbon (TOC) levels well below 5 ppb on its first operating cycle. This resin is ideal for low-end semiconductor, display panel, solar photovoltaic cell manufacturing, and other high-purity water applications requiring exceptional ionic and organic cleanliness.

DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing 0
Applications
  • Final polishing mixed bed deionization in ultrapure water (UPW) systems
  • Low-end semiconductor manufacturing
  • Display panel production
  • Solar photovoltaic (PV) cell industry
  • High-purity water polishing after reverse osmosis (RO) and electrodeionization (EDI)
Compatible System Designs
  • Mixed bed polishers (separate or layered bed)
  • Packed bed mixed bed systems
  • Refillable cartridges for portable exchange deionization (PDI / IX)
  • High-purity water polishing loops
Typical Properties
Physical and Chemical Properties:
Property Cation Resin Anion Resin
Copolymer Styrene-divinylbenzene Styrene-divinylbenzene
Matrix Gel Gel
Type Strong acid cation Strong base anion, Type I
Functional Group Sulfonic acid Trimethylammonium
Physical Form Dark amber translucent spherical beads Yellow translucent spherical beads
Ionic Form as Shipped H⁺ OH⁻
Total Exchange Capacity ≥ 1.80 eq/L ≥ 1.00 eq/L
Water Retention Capacity 49 - 55% 60 - 66%
Ionic Conversion (H⁺) ≥ 99% --
Ionic Conversion (OH⁻) -- ≥ 95.0%
Ionic Conversion (CO₂⁻) -- ≤ 5.0%
Ionic Conversion (Cl⁻) -- ≤ 0.5%
Particle Size Distribution:
Parameter Cation Resin Anion Resin
Particle Diameter 630 ± 50 μm 730 ± 50 μm
Uniformity Coefficient ≤ 1.25 ≤ 1.25
< 300 μm ≤ 0.1% ≤ 0.3%
> 850 μm ≤ 10.0% ≤ 10.0%
For additional particle size information, refer to Document No.: 45-D00954-en.
Performance and Operating Conditions
Ultrapure Water Quality Test Results:
  • Resistivity (UPW Rinse, 10-min): ≥ 18 MΩ·cm
  • Resistivity (Salt Challenge, 10-min): ≥ 18 MΩ·cm
  • Δ TOC (2h00 Rinse): ≤ 10 ppb C
Recommended Operating Conditions:
  • Temperature Range: 15 - 25°C (59 - 77°F)
  • pH Range (Stable): 0 - 14
  • Shipping Weight: 730 g/L
Operation at elevated temperatures (e.g., >60-70°C) may impact system purity and resin life. Consult DuPont technical representatives for details.
Hydraulic Characteristics
  • Pressure Drop: Estimated pressure drop as a function of service flow rate and water temperature is provided in Figure 1 (refer to original document for detailed curves).
  • Rinse Performance: Typical resistivity and TOC rinse curves as a function of rinse time are shown in Figure 2.
Safety and Regulatory Notes
WARNING: Strong oxidizing agents (e.g., nitric acid) may attack the resin under certain conditions, leading to degradation or violent reactions. Consult professionals before use.

Users are encouraged to review manufacturing processes and applications from health, safety, and environmental perspectives.

Refer to the latest Safety Data Sheet (SDS) before use and ensure compliance with local regulations.

For application cases, please visit: www.fgwater.com/Industries/

DuPont™ AmberTec™ UP6150 H/OH Mixed Bed Ion Exchange Resin – 18 MΩ·cm Ultrapure Water Polishing 1

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